ICCDN-2018 (2nd-3rd June) 2018.
Sikkim MANIPAL INSTITUTE OF TECHNOLOGY,sikkim
aT A GLANCE
full detail of iccdn-2018
The second International Conference in Communication, Devices and Networking (ICCDN 2018) was organized by the Department of Electronics and Communication Engineering, Sikkim Manipal Institute of Technology, Majhitar, Sikkim during 2nd-3rd June, 2018.
Smart cities are the wave of the future, providing one of the most fascinating and innovative applications for the internet of things (IoT), and offering untold benefits for governments and citizens around service provision, quality and safety of life. This motivates the organizer to have “SMART CITY” as the theme of the conference.
The aim of the Conference was to provide a platform for Researchers, Engineers, Academicians and Industry Professionals to present their recent research works and to explore future trends in various areas of Engineering. The conference also brought together both novice and experienced scientists and developers, to explore newer scopes, collect new ideas and establish new cooperation between research groups and exchange ideas, information, techniques and applications in the field of Electronics, Communication, Devices and Networking.
The ICCDN-2018 Committees rigorously invited submissions for many months
from researchers, scientists, engineers, students and practitioners related to the
relevant themes and tracks of the conference. The call for papers of the conference was divided into six tracks as mentioned,
Track-1: Electronics & Nano-technology,
Track-2: Energy & Power,
Track-4: Wireless Communication & Digital Signal Processing,
Track-5: Control & Instrumentation,
Track-6: Data Communication and Networking.
All the submissions underwent a strenuous peer-review process which comprised
expert reviewers. The papers were then reviewed based on their contributions, technical content,
originality and clarity. The entire process, which includes the submission, review
and acceptance processes, was done electronically. Total 156 nos. of papers have been received out of which 64 papers have been accepted. All these efforts undertaken by the Organizing Committees led to a high quality technical conference program, which featured high-impact presentations from guest speakers and from paper presenters. All attendees appreciate and expand their expertise in the latest developments in their relevant fields.
We would like to thank the Patrons, General Chairs, the members of the Technical Program Committees, Advisory Committees and reviewers for their excellent and tireless work. We also want to thank Springer for the
support, authors and sponsor , for sponsoring this very successful conference.
Subir Kumar Sarkar
Om Prakash Singh,